Molded Polystyrene Foam for Thermal Insulation

Expanded Polystyrene (EPS) Board

Formal Designation: Foam Polystyrene Board | Industry Abbreviation: EPS Board

Key Product Properties

• Ultra-Lightweight Structure
  Density 15-30 kg/m³ (≈1/50 concrete density), minimizing structural load
• Superior Thermal Performance
  Thermal conductivity: 0.032-0.044 W/(m·K) (5-8× efficiency of conventional materials)
• Moisture Resistance
  Closed-cell structure (>95% pore sealing) with • Composite sandwich panels |
  | Floor Engineering | • Underfloor heating insulation layer (20-50mm thickness) • Frost protection in subgrade construction |
  | Energy-Efficient Systems | • Roof slope insulation composites • Prefabricated modular building units |